Measurement of the thermal conductivity of copper samples between 30 and 150 mK

Year: 2004

Authors: Risegari L., Barucci M., Olivieri E., Pasca E., Ventura G.

Autors Affiliation: Department of Mechanics, University of Florence, Florence, Italy; INFM, Unity of Florence, Florence, Italy; Department of Physics, University of Florence, Florence, Italy

Abstract: We report data of thermal conductivity between 30 and 150 mK of three different types of commercial copper, before and after a thermal treatment of the samples. The measurements show that both purity and thermal treatment strongly influence the value of thermal conductivity. Data show a strict linear dependence on the temperature of the thermal conductivity.

Journal/Review: CRYOGENICS (GUILDF.)

Volume: 44 (12)      Pages from: 875  to: 878

KeyWords: Bending stresses; Commercial coppers; Electron-phonon scattering; Standard scaling, Annealing; Cooling; Data reduction; Electron scattering; Gravity waves; Heat treatment; Low temperature effects; Thermal conductivity; Thermometers, Copper
DOI: 10.1016/j.cryogenics.2004.01.008